WaferSense® Auto Teaching System™ (ATS2)

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WaferSense® Auto Teaching System™ (ATS2)

point

Wafer-shaped

Available in 200mm and 300mm wafer sizes.

Wireless and vacuum compatible

Travels like a wafer and takes less time as equipment stays sealed during inspection. Transmits data in real-time.

Highly accurate

Accurate to +-0.1mm (+-0.004in) x and y position; +-0.8mm (+-0.03in) z position.

Easy-to-use software

CyberSpectrum: Displays real-time video and measurements of target features, logs offsets and user comments.

Allows teaching of circular features, 3mm-10mm diameter. Review functionality integrated; replays log file data for review and analysis.

  • Plasma vapor deposition; PVD
  • Chemical vapor deposition; CVD, ALD
  • Photo lithography
  • Wet (chemical) etch, plasma etch
  • Dry etch
  • Ion implant
  • Automated handling system

 

 

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